CVE-2026-21385: Qualcomm Multiple Chipsets Memory Corruption Vulnerability

Added to the CISA Known Exploited Vulnerabilities catalog on 03 Mar 2026. Vendor: Qualcomm. Product: Multiple Chipsets.

Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation.

Required action: Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable. (due 24 Mar 2026)